Fill related papers and Survey
Our work:
1.
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Monte-Carlo Algorithms
for Layout Density Control", Proc.
Asia and South Pacific Design Automation Conf., Jan. 2000, pp. 523-528.
( ASPDAC00.pdf
)
2. Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Practical Iterated
Fill Synthesis for CMP Uniformity", Proc.
ACM/IEEE Design Automation Conf., June 2000, pp. 671-674. ( DAC00.pdf
)
3. Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Hierarchical Dummy
Fill for Process Uniformity", Proc.
Asia and South Pacific Design Automation Conf., Jan. 2001, pp. 139-144.
( ASPDAC01.pdf
)
4. Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Monte-Carlo Methods
for Chemical-Mechanical Planarization on Multiple-Layer and Dual-Material
Models", SPIE Conference on
Design and Process Integration for Microelectronic Manufacturing, Santa Clara,
March 2002, pp. 421-432. ( SPIE02.pdf )
5.
Y. Chen, A.
B. Kahng, G. Robins and A. Zelikovsky, "Closing the Smoothness and
Uniformity Gap in Area Fill Synthesis",
Proc. ACM/IEEE Intl. Symp. on Physical Design, April 2002, pp. 137-142. (
ISPD02.pdf)
6. Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Area Fill Synthesis
for Uniform Layout Density", IEEE
Trans. on Computer-Aided Design, 21(10) (2002), pp. 1132-1147. ( TCAD02.pdf
)
MIT papers:
1.
D. Ouma, C.
Oji, D. Boning, J. Chung, D. Hetherington, and P. Merkle, "Effect of High
Relative Speed on Planarization Length in Oxide Chemical Mechanical
Polishing," 1998 Chemical Mechanical Polish for ULSI Multilevel
Interconnection Conference (CMP-MIC), Santa Clara, Feb. 1998. ( PMIC98.ps
)
2. V. Mehrotra, S. Nassif, D. Boning, and J. Chung, "Modeling the Effects
of Manufacturing Variation on High-Speed Microprocessor Interconnect
Performance," 1998 International Electron Devices Meeting, San Francisco.
CA, Dec. 1998. ( IEDM98.pdf )
3. Stine, B., D. Ouma, R. Divecha, D. Boning, J. Chung, D. Hetherington,
I. Ali, G. Shinn, J. Clark, O. Nakagawa, S-Y Oh., ''A Closed-Form Analytic Model
for ILD Thickness Variation in CMP Processes,'' 1997 Chemical Mechanical Polish
for ULSI Multilevel Interconnection Conference (CMP-MIC), p. 266, Santa Clara,
February, 1997. ( PMIC97.stine.pdf )
4. D. Boning, B. Lee, T. Tubawa, and T. Park, "Models for Pattern
Dependencies: Capturing Effects in Oxide, STI, and Copper CMP," Semicon/West
Technical Symposium: CMP Technology for ULSI Manufacturing,, San Francisco, CA,
July 2001. ( SemiconWest2001.pdf )
5. B. Stine, D. Ouma, R. Divecha, D. Boning, J. Chung, ''Rapid Characterization
and Modeling of Pattern Dependent Variation in Chemical Mechanical Polishing,''
IEEE Trans. Semi. Manuf., vol. 11, no. 1, pp. 129-140, Feb. 1998. ( Stine-rapid-cmp.pdf
)
6. T. Tugbawa, T. Park, D. Boning, T. Pan, P. Li, S. Hymes, T. Brown, and L.
Camilletti, "A Mathematical Model of Pattern Dependencies in Cu CMP
Processes," CMP Symposium, Electrochemical Society Meeting, Honolulu, HA,
Oct. 1999. ( ecs99_paper_tugbawa.pdf )
Motorola's work:
1.
W. Grobman, M. Thompson, R. Wang, C. Yuan, R. Tian, and E. Demircan, 'Reticle
enhancement technology: Implications and challenges for physical design,' in
Proc. Design Automation Conf., Las Vegas, NV, 2001, pp. 73~78. ( GROB-37D.PDF
)
2. R. Tian, X. Tang, and D. F. Wong, 'Dummy feature placement for chemical
Mechanical polishing uniformity in a shallow trench isolation process,' in Int.
Symp. Physical Design, Apr. 2001. ( WongISPD2001.pdf
)
3. R. Tian, D. Wong, and R. Boone, “Model-based dummy feature placement
for oxide chemical–mechanical polishing manufacturability,” in Proc. Design
Automation Conf., June 2000, pp. 667~670. ( WongDAC00.pdf
)
Industry Survey
Industry Fill Tools Summary DAC 2002. ( Industry_Survey.pdf )