Tuck-Boon Chan is currently a Ph.D. student of the Electrical and Computer Engineering Department at University of California, San Diego. He received a B.S. in Electrical Engineering from University Technology Malaysia in 2003 and a M.S. from National Taiwan University in 2007. He is working under supervision of Professor Andrew B. Kahng.
VLSI circuit design and manufacturing co-optimization
Design methodology to mitigate manufacturing variability
Modeling circuit variation and reliability