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UCSD VLSI CAD LABORATORY
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Last Modified: October 11, 2006
Qinke Wang
Ph.D. Student
Computer Science and
Engineering Dept
University of California, San Diego 9500 Gilman Dr., Dept. 0404 San Diego, CA 92093-0404 Phone: (858) 822-5003 Areas of InterestVLSI CAD, combinatorial algorithms, bioinformatics
Biographical SketchQinke Wang (b. Dec. 1976, DaLian, P.R. China) received from Tsinghua University a M.S. in Computer Software in 2001 and a B.S. in Computer Science and Technology in 1998. He joined the Computer Science Department at UCSD in Sep. 2001, is a graduate research assistant in the field of VLSI CAD under Prof. Andrew B. Kahng since Sep. 2002, and is expected to receive a Ph.D. degree in Computer Science in June. 2006. Qinke Wang received a Jacob Fellowship in 2001, ICCD2005 Best Paper award, ICCAD2005 Best Paper nomination, and First Place of the ISPD2005 placement contest. His research interests include VLSI physical design and VLSI design-manufacturing interface, and is open to new research ideas.
Overview of ResearchThe foci of Qinke's past researches are on (i) analytical framework of circuit placement with constrained nonlinear optimization techniques and its extensions to a variety of placement tasks across many aspects of physical implementation, (ii) optimization during circuit placement for chip manufacturability and yield, (iii) detailed placement algorithm, (iv) optimization of production cost (mask and reticle cost) related to multi-project wafers, (v) planning of hierarchical, uniform power distribution in early design stages, with optimization for worst IR-drop or total metal area, and (vi) analysis of key deployment and methodology issues associated with the Y-architecture, a novel architecture for on-chip interconnect with three uniform routing directions.(1) APlace: A General Analytic Placement Framework. (2) Supply Voltage Degradation Aware Analytical Placement. (3) Lens Aberration Aware Timing-Driven Placement. (4) Detailed Placement. (5) Multi-Project Wafer and Reticle Cost Optimization. Multi-project wafers allow customers to share the expensive cost of a mask set and result in faster prototyping. Our research considers ways to minimize production costs for multi-project wafers. We have published one conference paper at ISPD04 and one journal version at TCAD05. (6) Power Grid Planning. Our research addresses planning of hierarchical, uniform power distribution in early design stages, so that for a fixed total routing area the worst-case IR-drop on the power mesh is minimal, or for a given IR-drop tolerance the power mesh achieves the IR-drop specification with minimal routing area. This work is published in ASP-DAC04. (7) The Y Interconnect Architecture. The Y-architecture for on-chip interconnect is based on pervasive use of 0-, 120-, and 240-degree oriented semi-global and global wiring. Its use of three uniform directions exploits on-chip routing resources more efficiently than traditional Manhattan wiring architecture. Our research provides a complete, technically in-depth analysis of key deployment and methodology issues associated with the Y-architecture for semiconductor ICs, including throughput analysis, estimates of wirelength savings, clock and power distribution methodology, wireability, and manufacturing. We have published two conference papers at SLIP03 and ICCAD03 and one journal paper at TCAD05 in this area. Publications[J5] A. B. Kahng, C.-H. Park, P. Sharma and Q. Wang, "Lens Aberration Aware Placement for Timing-Improvement", submitted to IEEE Transactions on Computer-Aided Design, 2005. [J4] A. B. Kahng, S. Reda and Q. Wang, "Anatomy of an Analytic Placer", submitted to ACM Journal of Experimental Algorithmics, 2005. [J3] A. B. Kahng, I. Mandoiu, Q. Wang, X. Xu, and A. Zelikovsky, "Multi-Project Reticle Floorplanning and Wafer Dicing", IEEE Transactions on Computer-Aided Design, to appear. [J2] A. B. Kahng, and Q. Wang, "Implementation and Extensibility of an Analytic Placer", IEEE Transactions on Computer-Aided Design 24(5) (2005), pp. 734-747. [J1] H. Chen, C. K. Cheng, A. B. Kahng, I. Mandoiu, Q. Wang and B. Yao, "The Y-architecture for On-Chip Interconnect: Analysis and Methodology", IEEE Transactions on Computer-Aided Design 24(4) (2005), pp. 588-599. [C13] C. J. Alpert, A. B. Kahng, C. N. Sze and Q. Wang, "Timing-Driven Steiner Trees are (Practically) Free", Proc. Design Automation Conference, July 2006, to appear. (Short) [C12] A. B. Kahng and Q. Wang, "A Faster Implementation of APlace", Proc. ACM/IEEE Intl. Symp. Physical Design, 2006, pp. 218-220. (Short Invited) [C11] A. B. Kahng, C.-H. Park, P. Sharma and Q. Wang, "Lens Aberration-Aware Timing-Driven Placement", Proc. Design Automation and Testing in Europe, 2006, pp. 890-895. [C10] A. B. Kahng, S. Reda and Q. Wang, "Architecture and Details of a High Quality, Large-Scale Analytical Placer", Proc. ACM/IEEE Intl. Conf. on Computer-Aided Design, 2005, pp. 891-898. (Best Paper Nomination) [C9] A. B. Kahng, B. Liu and Q. Wang, "Supply Voltage Degradation Aware Analytical Placement", Proc. ACM/IEEE Intl. Conf. on Computer Design, 2005, pp. 437-443. (Best Paper Award; 5 out of 310 submissions) [C8] Y.-S. Cheon, P.-H. Ho, A. B. Kahng, S. Reda and Q. Wang, "Power-Aware Placement", Proc. Design Automation Conference, 2005, pp. 795-800. [C7] A. B. Kahng, S. Reda and Q. Wang, "APlace: A General Analytic Placement Framework", Proc. ACM/IEEE Intl. Symp. Physical Design, April 2005, pp. 233-235. (Short Invited, 1st Place of ISPD05 Placement Contest) [C6] A. B. Kahng, and Q. Wang, "An Analytic Placer for Mixed-Size Placement and Timing-Driven Placement", Proc. ACM/IEEE Intl. Conf. Computer-Aided Design, Nov. 2004, pp. 565-572. [C5] A. B. Kahng, and Q. Wang, "Implementation and Extensibility of an Analytic Placer", Proc. ACM/IEEE Intl. Symp. Physical Design, April 2004, pp. 18-25. [C4] A. B. Kahng, I. Mandoiu, Q. Wang, X. Xu, and A. Zelikovsky, "Multi-Project Reticle Floorplanning and Wafer Dicing", Proc. ACM/IEEE Intl. Symp. Physical Design, April 2004, pp. 70-77. [C3] H. Chen, C. K. Cheng, A. B. Kahng, M. Mori and Q. Wang, "Optimal Planning for Mesh-Based Power Distribution", Proc. ASP-DAC 2004, Jan. 2004, pp. 444-449. [C2] H. Chen, C. K. Cheng, A. B. Kahng, I. Mandoiu, Q. Wang and B. Yao, "The Y-architecture for On-Chip Interconnect: Analysis and Methodology", Proc. IEEE/ACM Intl. Conf. Computer-Aided Design, Nov. 2003, pp. 13-19. [C1] H. Chen, C. K. Cheng, A. B. Kahng, I. Mandoiu and Q. Wang, "Estimation of Wirelength Reduction for ¦Ë-Geometry vs. Manhattan Placement and Routing", Proc. ACM Intl. Workshop on System-Level Interconnect Prediction, April 2003, pp. 71-76.
Qinke Wang and Lizhu Zhou, "Schema Based Data Storage
and Query Optimization for Semi-structured Data", Proc. 1st Int. Conf.
Web-Age Information Management (Lecture Notes in Computer Science, Vol.
1846, Springer), Jun. 2000, pp. 389-398.
Qinke Wang and Lizhu Zhou, "Schema-Based Rearrangement
of Semi-structured Data", Proc. 16th National Conf. of Database, Aug.
1999, China, pp.581-586. |